The cleanroom where circuits are printed on 300 mm silicon wafers - India's first commercial fab is Tata Electronics' Dholera plant with Taiwan's PSMC.
Taiwanese foundry licensing process technology and training staff for Tata's Dholera fab
Compiled from public reporting — not exchange-listed.
Builds chips layer by layer: lithography prints patterns, then etch, deposition, doping and polishing tools build up dozens of layers over 2-3 months per wafer. Finished wafers go to an OSAT for packaging.
Fabs are the costliest and most strategic step. Tata-PSMC's Dholera fab (~₹91,000 Cr, up to 50,000 wafers a month) starts on mature 55-90 nm nodes with 28 nm later; the minister has guided commercial production to mid-2028. Semicon 2.0 pays 40% of eligible capital cost for 300 mm silicon fabs of at least ₹20,000 Cr and 40,000 wafer starts a month.
Foundries earn high margins only at high utilisation and scale; new mature-node fabs compete with heavily subsidised Chinese capacity. In India the only fab owner is unlisted, so there is no direct listed play - listed exposure comes only through its suppliers.