Silicon-carbide (SiC) and gallium-nitride (GaN) chips, micro-LED displays and glass-substrate packaging - the newer, more specialised projects under the mission.
Integrated gallium-nitride (GaN) compound-semiconductor and micro-LED display fab with packaging at Dholera
Compiled from public reporting — not exchange-listed.
Compound semiconductors such as SiC and GaN switch high power efficiently (EV inverters, chargers, solar, rail) and need their own smaller fabs. Advanced packaging stacks or links several chips on one substrate - glass substrates are an emerging way to do this for AI chips.
Semicon 2.0 gives compound, photonics, sensor and discrete fabs 35% of capital cost from just ₹500 Cr of investment, and advanced packaging 35%. Approved projects include SiCSem (Archean Chemical's subsidiary, Odisha, ~₹2,066 Cr, fiscal-support agreement 11 May 2026), 3D Glass Solutions' glass-substrate unit (Odisha, groundbreaking Apr 2026) and Crystal Matrix's GaN/micro-LED fab (Dholera, approved May 2026).
Smaller plants, faster payback and fewer competitors than silicon fabs - SiC power chips sell at much higher prices per wafer. But each Indian project is first-of-a-kind and pre-revenue, so value is an option on execution.